Bioresorbable Multilayer Photonic Cavities as Temporary Implants for Tether-Free Measurements of Regional Tissue Temperatures.

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Title: Bioresorbable Multilayer Photonic Cavities as Temporary Implants for Tether-Free Measurements of Regional Tissue Temperatures.
Authors: Bai W; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Irie M; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Liu Z; Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76019, USA., Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA., Franklin D; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Nandoliya K; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, USA., Guo H; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Zang H; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA., Weng Y; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA., Lu D; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Wu D; Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA., Wu Y; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Song J; Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA., Han M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Song E; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, USA., Yang Y; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Chen X; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, China., Zhao H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA., Lu W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Monti G; Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA., Stepien I; The Center for Developmental Therapeutics, Northwestern University, Evanston, Illinois 60208, USA., Kandela I; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Haney CR; Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Center for Advanced Molecular Imaging, Northwestern University, Evanston, Illinois 60208, USA., Wu C; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Ryu H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Rwei A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Shen H; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Kim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea., Yoon HJ; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea., Ouyang W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Liu Y; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA., Suen E; Department of Neurobiology, Northwestern University, Evanston, Illinois 60208, USA., Chen HY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA., Okina J; Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208, USA., Liang J; Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208, USA., Huang Y; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208, USA., Ameer GA; Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, USA.; Northwestern Medicine, Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, USA.; Center for Advanced Regenerative Engineering, Northwestern University, Evanston, Illinois 60208, USA., Zhou W; Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76019, USA., Rogers JA; Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA.; Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, USA.; Northwestern Medicine, Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, USA.; Center for Advanced Regenerative Engineering, Northwestern University, Evanston, Illinois 60208, USA.
Source: BME frontiers [BME Front] 2021 Jan 15; Vol. 2021, pp. 8653218. Date of Electronic Publication: 2021 Jan 15 (Print Publication: 2021).
Publication Type: Journal Article
Journal Info: Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 101775616 Publication Model: eCollection Cited Medium: Internet ISSN: 2765-8031 (Electronic) Linking ISSN: 27658031 NLM ISO Abbreviation: BME Front Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2765-8031
DOI:10.34133/2021/8653218