| Authors: |
Jagtap AA; Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, Taipei, 10608, Taiwan., Kanke V; Department of physics, PDEA's Annsaheb Magar Mahavidyalaya, Savitribai Phule Pune University, Pune, 411028, India., Sakthivel R; Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, Taipei, 10608, Taiwan., Katkar AS; Dr. B. N. Purandare Arts, Smt. S. G. G. Commerce and Smt. S. A. M. Science College, Lonavala, 410403, MS, India., Lin LY; Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, Taipei, 10608, Taiwan., Lin YC; School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore; BIOBOND LTD, Corsham, Wiltshire, SN13 0BH, United Kingdom., Liu X; College of Materials Science and Engineering, Chinese Engineering and Research Institute of Microelectronics, Shenzhen University, Shenzhen, 518060, China; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, 117583, Singapore., Gong CS; Department of Electrical Engineering, National Central University, Zhongli, Taoyuan, 320317, Taiwan. Electronic address: alexgong@cc.ncu.edu.tw., Tung CW; Department of Materials Engineering, Ming Chi University of Technology, New Taipei City, 24301, Taiwan. Electronic address: chingweitung@mail.mcut.edu.tw., Chung RJ; Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, Taipei, 10608, Taiwan; High-value Biomaterials Research and Commercialization Center, National Taipei University of Technology, Taipei, 10608, Taiwan. Electronic address: rjchung@mail.ntut.edu.tw. |
