| Authors: |
Xue L; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn., Chen H; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn., Zhou H; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn., Wu Y; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn., Wei C; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn., Jiang Y; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn., Cui HY; College of Electronics and Information Engineering, Shanghai University of Electric Power Shanghai P. R. China cuihy@shiep.edu.cn. |
