Electroactive Carbon Regulated Electrodeposition Process of Copper and the Application in Liquid Metals Patterning for Flexible Electronics.
Saved in:
| Title: | Electroactive Carbon Regulated Electrodeposition Process of Copper and the Application in Liquid Metals Patterning for Flexible Electronics. |
|---|---|
| Authors: | Ze Y; Key Laboratory of Flexible Electronics (KLoFE) and Institute of Advanced Materials (IAM), Nanjing Tech University, 30 South Puzhu Road, Nanjing, Jiangsu, 211816, China., Sun H; Key Laboratory of Flexible Electronics (KLoFE) and Institute of Advanced Materials (IAM), Nanjing Tech University, 30 South Puzhu Road, Nanjing, Jiangsu, 211816, China., Huang W; Key Laboratory of Flexible Electronics (KLoFE) and Institute of Advanced Materials (IAM), Nanjing Tech University, 30 South Puzhu Road, Nanjing, Jiangsu, 211816, China.; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials and Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, China. |
| Source: | Chemistry, an Asian journal [Chem Asian J] 2025 Nov; Vol. 20 (21), pp. e00829. Date of Electronic Publication: 2025 Sep 22. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: Wiley-VCH Country of Publication: Germany NLM ID: 101294643 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1861-471X (Electronic) Linking ISSN: 1861471X NLM ISO Abbreviation: Chem Asian J Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
| ISSN: | 1861-471X |
|---|---|
| DOI: | 10.1002/asia.202500829 |
