APA (7th ed.) Citation

Y, Z., H, S., & W, H. (2025). Electroactive Carbon Regulated Electrodeposition Process of Copper and the Application in Liquid Metals Patterning for Flexible Electronics. Chemistry, an Asian journal, 20(21), e00829. https://doi.org/10.1002/asia.202500829

Chicago Style (17th ed.) Citation

Y, Ze, Sun H, and Huang W. "Electroactive Carbon Regulated Electrodeposition Process of Copper and the Application in Liquid Metals Patterning for Flexible Electronics." Chemistry, an Asian Journal 20, no. 21 (2025): e00829. https://doi.org/10.1002/asia.202500829.

MLA (9th ed.) Citation

Y, Ze, et al. "Electroactive Carbon Regulated Electrodeposition Process of Copper and the Application in Liquid Metals Patterning for Flexible Electronics." Chemistry, an Asian Journal, vol. 20, no. 21, 2025, p. e00829, https://doi.org/10.1002/asia.202500829.