| Authors: |
Li Q; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Kulkarni SP; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA., Sui C; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Chen TH; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA.; Thomas Lord Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC, USA., Yan G; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Wu R; School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore., Chen W; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Hung PJ; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Wu X; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Emersic T; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Aydin K; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA., Hsu PC; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA. pochunhsu@uchicago.edu. |
