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Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties.

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Title: Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties.
Authors: Sung YC; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan., Hu CP; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan., Hung CC; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan., Hwang SJ; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan. jimppl@mail.ncku.edu.tw., Shih MH; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan, 710301, Taiwan., Liao WH; Packaging Product Simulation and Design, Innolux Corporation, Tainan, 744092, Taiwan., Zeng YJ; Packaging Product Simulation and Design, Innolux Corporation, Tainan, 744092, Taiwan., Tsai CT; Testing Center, Innolux Corporation, Tainan, 744092, Taiwan.
Source: Scientific reports [Sci Rep] 2026 Jan 03; Vol. 16 (1), pp. 3994. Date of Electronic Publication: 2026 Jan 03.
Publication Type: Journal Article
Journal Info: Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
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PubType: Academic Journal
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  Data: Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties.
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  Data: <searchLink fieldCode="AU" term="%22Sung+YC%22">Sung YC</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hu+CP%22">Hu CP</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hung+CC%22">Hung CC</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan.<br /><searchLink fieldCode="AU" term="%22Hwang+SJ%22">Hwang SJ</searchLink>; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan. jimppl@mail.ncku.edu.tw.<br /><searchLink fieldCode="AU" term="%22Shih+MH%22">Shih MH</searchLink>; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan, 710301, Taiwan.<br /><searchLink fieldCode="AU" term="%22Liao+WH%22">Liao WH</searchLink>; Packaging Product Simulation and Design, Innolux Corporation, Tainan, 744092, Taiwan.<br /><searchLink fieldCode="AU" term="%22Zeng+YJ%22">Zeng YJ</searchLink>; Packaging Product Simulation and Design, Innolux Corporation, Tainan, 744092, Taiwan.<br /><searchLink fieldCode="AU" term="%22Tsai+CT%22">Tsai CT</searchLink>; Testing Center, Innolux Corporation, Tainan, 744092, Taiwan.
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  Data: <searchLink fieldCode="JN" term="%22101563288%22">Scientific reports</searchLink> [Sci Rep] 2026 Jan 03; Vol. 16 (1), pp. 3994. <i>Date of Electronic Publication: </i>2026 Jan 03.
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  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22Nature+Publishing+Group%22">Nature Publishing Group </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101563288 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2045-2322 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220452322%22">20452322 </searchLink><i>NLM ISO Abbreviation: </i>Sci Rep <i>Subsets: </i>MEDLINE; PubMed not MEDLINE
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        Value: 10.1038/s41598-025-34076-2
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              Text: 2026 Jan 03
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              Y: 2026
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