| Authors: |
Bui TAN; International College of Semiconductor Technology, National Yang Ming Chiao Tung University, 1001 Daxue Road, Hsinchu 300093, Taiwan. yushengsu@nycu.edu.tw., Nguyen T; International College of Semiconductor Technology, National Yang Ming Chiao Tung University, 1001 Daxue Road, Hsinchu 300093, Taiwan. yushengsu@nycu.edu.tw., Yang CK; Industry Academia Innovation School, National Yang Ming Chiao Tung University, 1001 Daxue Road, Hsinchu 300093, Taiwan., Chang JK; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, 1001 Daxue Road, Hsinchu 300093, Taiwan., Su YS; International College of Semiconductor Technology, National Yang Ming Chiao Tung University, 1001 Daxue Road, Hsinchu 300093, Taiwan. yushengsu@nycu.edu.tw.; Industry Academia Innovation School, National Yang Ming Chiao Tung University, 1001 Daxue Road, Hsinchu 300093, Taiwan. |
