| Authors: |
Zhang J; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore., Wang J; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore., Liu D; School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China., Andreev M; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore., Peng Z; Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China., Wei J; Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China., Bozcali AE; Department of Materials Science and Engineering, National University of Singapore, Singapore, Singapore., Jain S; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore., Zheng H; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore., Avsar A; Department of Materials Science and Engineering, National University of Singapore, Singapore, Singapore., Zhang M; School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China., Chan M; Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China., Ang KW; Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore. eleakw@nus.edu.sg. |
