| Authors: |
Zhang F; Xiangfu Laboratory, Jiashan, 314100, China; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China., Wang K; Xiangfu Laboratory, Jiashan, 314100, China., Shu X; Xiangfu Laboratory, Jiashan, 314100, China., Su D; Xiangfu Laboratory, Jiashan, 314100, China., Yu Y; School of Materials Engineering, Changzhou Vocational Institute of Industry Technology, Changzhou, 213164, China., Chen C; School of Microelectronics, Shanghai University, Shanghai, 2018004, China; Institute of Medical Chip, Ruijin Hospital, Shanghai Jiao Tong University School of Medicine, Shanghai, 200025, China., Zhao J; Xiangfu Laboratory, Jiashan, 314100, China; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China; School of Microelectronics, Shanghai University, Shanghai, 2018004, China; Shanghai Frontier Innovation Research Institute, Shanghai, 201108, China., Feng S; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China. Electronic address: shilun.feng@mail.sim.ac.cn., Liu B; Xiangfu Laboratory, Jiashan, 314100, China. Electronic address: liubo@xflab.org.cn. |
