| Authors: |
Pei M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Gao T; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China., Liu L; Department of Radiology, Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, Nanjing, China., Li W; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore., Long H; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Luo Y; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore., Teng Z; Key Laboratory for Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials, Jiangsu National Synergetic Innovation Centre for Advanced Materials, Nanjing University of Posts and Telecommunications, Nanjing, P. R. China., Cui H; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Li X; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Dai Q; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Shi K; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Qiao L; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Peng B; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Xing Q; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Wen M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Han M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Wan Z; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Li Y; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. yli@nju.edu.cn., Xue B; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China. xuebinnju@nju.edu.cn., Cao Y; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China., Shi Y; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. yshi@nju.edu.cn., Wan Q; Yongjiang Laboratory (Y-LAB), Ningbo, China. wanqing@nju.edu.cn., Chen X; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore. chenxd@ntu.edu.sg.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore. chenxd@ntu.edu.sg., Wan C; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. cjwan@nju.edu.cn.; Yongjiang Laboratory (Y-LAB), Ningbo, China. cjwan@nju.edu.cn. |
