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Author Correction: An iontronic reservoir for highly robust neuromorphic prosthesis.

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Title: Author Correction: An iontronic reservoir for highly robust neuromorphic prosthesis.
Authors: Pei M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Gao T; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China., Liu L; Department of Radiology, Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, Nanjing, China., Li W; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore., Long H; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Luo Y; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore., Teng Z; Key Laboratory for Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials, Jiangsu National Synergetic Innovation Centre for Advanced Materials, Nanjing University of Posts and Telecommunications, Nanjing, P. R. China., Cui H; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Li X; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Dai Q; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Shi K; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Qiao L; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Peng B; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Xing Q; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Wen M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Han M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Wan Z; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China., Li Y; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. yli@nju.edu.cn., Xue B; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China. xuebinnju@nju.edu.cn., Cao Y; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China., Shi Y; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. yshi@nju.edu.cn., Wan Q; Yongjiang Laboratory (Y-LAB), Ningbo, China. wanqing@nju.edu.cn., Chen X; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore. chenxd@ntu.edu.sg.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore. chenxd@ntu.edu.sg., Wan C; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. cjwan@nju.edu.cn.; Yongjiang Laboratory (Y-LAB), Ningbo, China. cjwan@nju.edu.cn.
Source: Nature materials [Nat Mater] 2026 Jun; Vol. 25 (6), pp. 1068.
Publication Type: Published Erratum
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101155473 Publication Model: Print Cited Medium: Internet ISSN: 1476-4660 (Electronic) Linking ISSN: 14761122 NLM ISO Abbreviation: Nat Mater Subsets: MEDLINE; In Process
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  Data: Author Correction: An iontronic reservoir for highly robust neuromorphic prosthesis.
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  Data: <searchLink fieldCode="AU" term="%22Pei+M%22">Pei M</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Gao+T%22">Gao T</searchLink>; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China.<br /><searchLink fieldCode="AU" term="%22Liu+L%22">Liu L</searchLink>; Department of Radiology, Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, Nanjing, China.<br /><searchLink fieldCode="AU" term="%22Li+W%22">Li W</searchLink>; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore.<br /><searchLink fieldCode="AU" term="%22Long+H%22">Long H</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Luo+Y%22">Luo Y</searchLink>; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore.<br /><searchLink fieldCode="AU" term="%22Teng+Z%22">Teng Z</searchLink>; Key Laboratory for Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials, Jiangsu National Synergetic Innovation Centre for Advanced Materials, Nanjing University of Posts and Telecommunications, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Cui+H%22">Cui H</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Li+X%22">Li X</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Dai+Q%22">Dai Q</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Shi+K%22">Shi K</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Qiao+L%22">Qiao L</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Peng+B%22">Peng B</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Xing+Q%22">Xing Q</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Wen+M%22">Wen M</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Han+M%22">Han M</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Wan+Z%22">Wan Z</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China.<br /><searchLink fieldCode="AU" term="%22Li+Y%22">Li Y</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. yli@nju.edu.cn.<br /><searchLink fieldCode="AU" term="%22Xue+B%22">Xue B</searchLink>; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China. xuebinnju@nju.edu.cn.<br /><searchLink fieldCode="AU" term="%22Cao+Y%22">Cao Y</searchLink>; Collaborative Innovation Center of Advanced Microstructures, School of Physics, Nanjing University, Nanjing, China.<br /><searchLink fieldCode="AU" term="%22Shi+Y%22">Shi Y</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. yshi@nju.edu.cn.<br /><searchLink fieldCode="AU" term="%22Wan+Q%22">Wan Q</searchLink>; Yongjiang Laboratory (Y-LAB), Ningbo, China. wanqing@nju.edu.cn.<br /><searchLink fieldCode="AU" term="%22Chen+X%22">Chen X</searchLink>; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, Singapore. chenxd@ntu.edu.sg.; Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore. chenxd@ntu.edu.sg.<br /><searchLink fieldCode="AU" term="%22Wan+C%22">Wan C</searchLink>; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing, P. R. China. cjwan@nju.edu.cn.; Yongjiang Laboratory (Y-LAB), Ningbo, China. cjwan@nju.edu.cn.
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