High-κ KBe2BO3F2 dielectric material with wide bandgap for two-dimensional electronics.

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Title: High-κ KBe2BO3F2 dielectric material with wide bandgap for two-dimensional electronics.
Authors: Xu Y; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China., Liu K; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China., Peng G; State Key Laboratory of Crystal Materials, Tianjin Key Laboratory of Functional Crystal Materials, Institute of Functional Crystal, Tianjin University of Technology, Tianjin, China., Liu T; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China., Sun L; School of Physics, Huazhong University of Science and Technology, Wuhan, China.; Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, China., Xiong X; School of Integrated Circuits and Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing, China., Wu Y; School of Integrated Circuits and Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing, China., Sun H; Institute of Physics, Chinese Academy of Sciences, Beijing, China., Bai X; Institute of Physics, Chinese Academy of Sciences, Beijing, China., Zhu Y; Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, China., Xiao Z; Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, China., Li H; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China., Zhai T; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China. zhaity@hust.edu.cn.
Source: Nature communications [Nat Commun] 2026 Mar 23; Vol. 17 (1). Date of Electronic Publication: 2026 Mar 23.
Publication Type: Journal Article
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
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ISSN:2041-1723
DOI:10.1038/s41467-026-70711-w