Thermal-stress enhanced pyroelectricity in piezoelectric bimorphs.

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Title: Thermal-stress enhanced pyroelectricity in piezoelectric bimorphs.
Authors: Su CM; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Lin CC; Applied Science and Technology Graduate Group, University of California at Berkeley, Berkeley, CA, USA.; Rice Advanced Materials Institute, Rice University, Houston, TX, USA., Chen YC; Department of Physics, National Taiwan Normal University, Taipei, Taiwan. yichengchen@ntnu.edu.tw., Liu CX; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan., Wang YJ; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan., Xu Y; Key Laboratory of Polar Materials and Devices (MOE), East China Normal University, Shanghai, China.; Shanghai Center of Brain-inspired Intelligent Materials and Devices, East China Normal University, Shanghai, China.; Department of Electronics, East China Normal University, Shanghai, China., Tian B; Key Laboratory of Polar Materials and Devices (MOE), East China Normal University, Shanghai, China.; Shanghai Center of Brain-inspired Intelligent Materials and Devices, East China Normal University, Shanghai, China.; Department of Electronics, East China Normal University, Shanghai, China., Lu S; State Key Laboratory of Low-Dimensional Quantum Physics and Department of Physics, Tsinghua University, Beijing, China., Li C; State Key Laboratory of Low-Dimensional Quantum Physics and Department of Physics, Tsinghua University, Beijing, China., Duan CG; Key Laboratory of Polar Materials and Devices (MOE), East China Normal University, Shanghai, China.; Shanghai Center of Brain-inspired Intelligent Materials and Devices, East China Normal University, Shanghai, China.; Department of Electronics, East China Normal University, Shanghai, China., Yang JC; Department of Physics, National Cheng Kung University, Tainan, Taiwan., Yeh CN; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan., Wu JM; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan., Yu P; Department of Physics, Tsinghua University, Beijing, China., Chen YC; Department of Physics, National Cheng Kung University, Tainan, Taiwan., Tsou NT; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan. tsounienti@nycu.edu.tw., Martin LW; Rice Advanced Materials Institute, Rice University, Houston, TX, USA. lwmartin@rice.edu.; Departments of Materials Science and NanoEngineering, Rice University, Houston, TX, USA. lwmartin@rice.edu.; Departments of Chemistry, Rice University, Houston, TX, USA. lwmartin@rice.edu.; Departments of Physics and Astronomy, Rice University, Houston, TX, USA. lwmartin@rice.edu., Chu YH; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan. yhchu@mx.nthu.edu.tw.; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan. yhchu@mx.nthu.edu.tw.
Source: Nature communications [Nat Commun] 2026 Apr 13; Vol. 17 (1). Date of Electronic Publication: 2026 Apr 13.
Publication Type: Journal Article
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2041-1723
DOI:10.1038/s41467-026-71287-1