| Authors: |
Yoo J; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Park M; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Oh S; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Kim S; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Lee H; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Jung S; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Park S; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Lim S; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea., Song JM; Department of Intelligent Semiconductor Engineering, University of Seoul, Seoul, Republic of Korea., Heo JW; Department of Intelligent Semiconductor Engineering, University of Seoul, Seoul, Republic of Korea., Seo GD; Department of Intelligent Semiconductor Engineering, University of Seoul, Seoul, Republic of Korea., Lee K; Department of Materials Science & Engineering, Hongik University, Seoul, Republic of Korea., Yoon S; Department of Physics, Gachon University, Seongnam, Republic of Korea., Kim T; Department of Intelligent Semiconductor Engineering, University of Seoul, Seoul, Republic of Korea., Bae H; Department of Electronic Engineering, Jeonbuk National University, Jeonju, Republic of Korea.; IT Convergence Research Center, Jeonbuk National University, Jeonju, Republic of Korea. |
