| Authors: |
Lee SH; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan, USA.; Center For Complex Particle Systems (COMPASS), University of Michigan, Ann Arbor, Michigan, USA.; Biointerfaces Institute, University of Michigan, Ann Arbor, Michigan, USA., Jung HJ; Center For Complex Particle Systems (COMPASS), University of Michigan, Ann Arbor, Michigan, USA.; Biointerfaces Institute, University of Michigan, Ann Arbor, Michigan, USA.; Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan, USA., Kim J; Center For Complex Particle Systems (COMPASS), University of Michigan, Ann Arbor, Michigan, USA.; Biointerfaces Institute, University of Michigan, Ann Arbor, Michigan, USA.; Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan, USA., Park BC; Center For Complex Particle Systems (COMPASS), University of Michigan, Ann Arbor, Michigan, USA.; Biointerfaces Institute, University of Michigan, Ann Arbor, Michigan, USA.; Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan, USA.; Department of Material Science and Engineering, Korea University, Seoul, Republic of Korea., da Silva CVCR; Department of Chemistry, Federal University of São Carlos, São Carlos, São Paulo, Brazil., de Moura AF; Department of Chemistry, Federal University of São Carlos, São Carlos, São Paulo, Brazil., Kotov NA; Center For Complex Particle Systems (COMPASS), University of Michigan, Ann Arbor, Michigan, USA.; Biointerfaces Institute, University of Michigan, Ann Arbor, Michigan, USA.; Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan, USA. |
