An integrated CMOS micro search‑coil magnetometer with on‑chip calibration and a low‑noise amplifier.

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Title: An integrated CMOS micro search‑coil magnetometer with on‑chip calibration and a low‑noise amplifier.
Authors: Tavakkoli H; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China.; Hong Kong Center for Construction Robotics, Hong Kong Science Park, Hong Kong SAR, China., Ahmed M; Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China., Shah I; Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China., Fang S; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China., Chen W; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China., Bermak A; Department of Information and Computing Technology, College of Science and Engineering, Hamad Bin Khalifa University, Doha, Qatar., Lee YK; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China. meyklee@ust.hk.; Hong Kong Center for Construction Robotics, Hong Kong Science Park, Hong Kong SAR, China. meyklee@ust.hk.
Source: Microsystems & nanoengineering [Microsyst Nanoeng] 2026 Jun 10; Vol. 12 (1). Date of Electronic Publication: 2026 Jun 10.
Publication Type: Journal Article
Journal Info: Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101695458 Publication Model: Electronic Cited Medium: Internet ISSN: 2055-7434 (Electronic) Linking ISSN: 20557434 NLM ISO Abbreviation: Microsyst Nanoeng Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
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  Data: An integrated CMOS micro search‑coil magnetometer with on‑chip calibration and a low‑noise amplifier.
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  Data: <searchLink fieldCode="AU" term="%22Tavakkoli+H%22">Tavakkoli H</searchLink>; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China.; Hong Kong Center for Construction Robotics, Hong Kong Science Park, Hong Kong SAR, China.<br /><searchLink fieldCode="AU" term="%22Ahmed+M%22">Ahmed M</searchLink>; Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China.<br /><searchLink fieldCode="AU" term="%22Shah+I%22">Shah I</searchLink>; Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China.<br /><searchLink fieldCode="AU" term="%22Fang+S%22">Fang S</searchLink>; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China.<br /><searchLink fieldCode="AU" term="%22Chen+W%22">Chen W</searchLink>; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China.<br /><searchLink fieldCode="AU" term="%22Bermak+A%22">Bermak A</searchLink>; Department of Information and Computing Technology, College of Science and Engineering, Hamad Bin Khalifa University, Doha, Qatar.<br /><searchLink fieldCode="AU" term="%22Lee+YK%22">Lee YK</searchLink>; Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong SAR, China. meyklee@ust.hk.; Hong Kong Center for Construction Robotics, Hong Kong Science Park, Hong Kong SAR, China. meyklee@ust.hk.
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  Data: <searchLink fieldCode="JN" term="%22101695458%22">Microsystems & nanoengineering</searchLink> [Microsyst Nanoeng] 2026 Jun 10; Vol. 12 (1). <i>Date of Electronic Publication: </i>2026 Jun 10.
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        Value: 10.1038/s41378-026-01334-w
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              Text: 2026 Jun 10
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