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A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.

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Bibliographic Details
Title: A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.
Authors: Becker, K.-F., Braun, T., Neumann, A.
Source: Journal of Electronic Packaging; March 2005, Vol. 127 Issue 1, p1-6, 6p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501058614
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501058614
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1115/1.1846058
    Languages:
      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 1
    Titles:
      – TitleFull: A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.
        Type: main
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          Name:
            NameFull: Becker, K.-F.
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            NameFull: Braun, T.
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            NameFull: Neumann, A.
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            – D: 01
              M: 03
              Text: March 2005
              Type: published
              Y: 2005
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              Value: 127
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            – TitleFull: Journal of Electronic Packaging
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