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High-thermal-conductivity integrated EWOD chip for ultra-fast, low-cost pathogen detection.

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Title: High-thermal-conductivity integrated EWOD chip for ultra-fast, low-cost pathogen detection.
Authors: Zhang F; Xiangfu Laboratory, Jiashan, 314100, China; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China., Wang K; Xiangfu Laboratory, Jiashan, 314100, China., Shu X; Xiangfu Laboratory, Jiashan, 314100, China., Su D; Xiangfu Laboratory, Jiashan, 314100, China., Yu Y; School of Materials Engineering, Changzhou Vocational Institute of Industry Technology, Changzhou, 213164, China., Chen C; School of Microelectronics, Shanghai University, Shanghai, 2018004, China; Institute of Medical Chip, Ruijin Hospital, Shanghai Jiao Tong University School of Medicine, Shanghai, 200025, China., Zhao J; Xiangfu Laboratory, Jiashan, 314100, China; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China; School of Microelectronics, Shanghai University, Shanghai, 2018004, China; Shanghai Frontier Innovation Research Institute, Shanghai, 201108, China., Feng S; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China. Electronic address: shilun.feng@mail.sim.ac.cn., Liu B; Xiangfu Laboratory, Jiashan, 314100, China. Electronic address: liubo@xflab.org.cn.
Source: Analytica chimica acta [Anal Chim Acta] 2026 May 08; Vol. 1398, pp. 345227. Date of Electronic Publication: 2026 Feb 13.
Publication Type: Journal Article
Journal Info: Publisher: Elsevier Country of Publication: Netherlands NLM ID: 0370534 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1873-4324 (Electronic) Linking ISSN: 00032670 NLM ISO Abbreviation: Anal Chim Acta Subsets: MEDLINE
Database: MEDLINE Ultimate
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  Data: High-thermal-conductivity integrated EWOD chip for ultra-fast, low-cost pathogen detection.
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  Data: <searchLink fieldCode="AU" term="%22Zhang+F%22">Zhang F</searchLink>; Xiangfu Laboratory, Jiashan, 314100, China; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China.<br /><searchLink fieldCode="AU" term="%22Wang+K%22">Wang K</searchLink>; Xiangfu Laboratory, Jiashan, 314100, China.<br /><searchLink fieldCode="AU" term="%22Shu+X%22">Shu X</searchLink>; Xiangfu Laboratory, Jiashan, 314100, China.<br /><searchLink fieldCode="AU" term="%22Su+D%22">Su D</searchLink>; Xiangfu Laboratory, Jiashan, 314100, China.<br /><searchLink fieldCode="AU" term="%22Yu+Y%22">Yu Y</searchLink>; School of Materials Engineering, Changzhou Vocational Institute of Industry Technology, Changzhou, 213164, China.<br /><searchLink fieldCode="AU" term="%22Chen+C%22">Chen C</searchLink>; School of Microelectronics, Shanghai University, Shanghai, 2018004, China; Institute of Medical Chip, Ruijin Hospital, Shanghai Jiao Tong University School of Medicine, Shanghai, 200025, China.<br /><searchLink fieldCode="AU" term="%22Zhao+J%22">Zhao J</searchLink>; Xiangfu Laboratory, Jiashan, 314100, China; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China; School of Microelectronics, Shanghai University, Shanghai, 2018004, China; Shanghai Frontier Innovation Research Institute, Shanghai, 201108, China.<br /><searchLink fieldCode="AU" term="%22Feng+S%22">Feng S</searchLink>; State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Tech-nology, Chinese Academy of Sciences, Shanghai, 200050, China. Electronic address: shilun.feng@mail.sim.ac.cn.<br /><searchLink fieldCode="AU" term="%22Liu+B%22">Liu B</searchLink>; Xiangfu Laboratory, Jiashan, 314100, China. Electronic address: liubo@xflab.org.cn.
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        Value: 10.1016/j.aca.2026.345227
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              Text: 2026 May 08
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