View in EDS

A review of glass thermal reflow: method, device, and applications.

Saved in:
Bibliographic Details
Title: A review of glass thermal reflow: method, device, and applications.
Authors: Zhu M; Instrumentation Technology and Economy Institute, Beijing, 100055, China. zmj@tc124.com., Shi P; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China., Zhang G; Instrumentation Technology and Economy Institute, Beijing, 100055, China., Yan C; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China., Chen F; Instrumentation Technology and Economy Institute, Beijing, 100055, China., Liu S; Instrumentation Technology and Economy Institute, Beijing, 100055, China., Lian R; Instrumentation Technology and Economy Institute, Beijing, 100055, China., Zhu K; Instrumentation Technology and Economy Institute, Beijing, 100055, China., Dai H; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China., Wu H; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China., Liu Y; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China., Li B; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China., Du X; Instrumentation Technology and Economy Institute, Beijing, 100055, China., Xue G; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China. xuegaopeng@hit.edu.cn.
Source: Microsystems & nanoengineering [Microsyst Nanoeng] 2026 May 13; Vol. 12 (1). Date of Electronic Publication: 2026 May 13.
Publication Type: Journal Article; Review
Journal Info: Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101695458 Publication Model: Electronic Cited Medium: Internet ISSN: 2055-7434 (Electronic) Linking ISSN: 20557434 NLM ISO Abbreviation: Microsyst Nanoeng Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
FullText Text:
  Availability: 0
Header DbId: mdl
DbLabel: MEDLINE Ultimate
An: 42129150
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: A review of glass thermal reflow: method, device, and applications.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Zhu+M%22">Zhu M</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China. zmj@tc124.com.<br /><searchLink fieldCode="AU" term="%22Shi+P%22">Shi P</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.<br /><searchLink fieldCode="AU" term="%22Zhang+G%22">Zhang G</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China.<br /><searchLink fieldCode="AU" term="%22Yan+C%22">Yan C</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.<br /><searchLink fieldCode="AU" term="%22Chen+F%22">Chen F</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China.<br /><searchLink fieldCode="AU" term="%22Liu+S%22">Liu S</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China.<br /><searchLink fieldCode="AU" term="%22Lian+R%22">Lian R</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China.<br /><searchLink fieldCode="AU" term="%22Zhu+K%22">Zhu K</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China.<br /><searchLink fieldCode="AU" term="%22Dai+H%22">Dai H</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.<br /><searchLink fieldCode="AU" term="%22Wu+H%22">Wu H</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.<br /><searchLink fieldCode="AU" term="%22Liu+Y%22">Liu Y</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.<br /><searchLink fieldCode="AU" term="%22Li+B%22">Li B</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China.<br /><searchLink fieldCode="AU" term="%22Du+X%22">Du X</searchLink>; Instrumentation Technology and Economy Institute, Beijing, 100055, China.<br /><searchLink fieldCode="AU" term="%22Xue+G%22">Xue G</searchLink>; Guangdong Provincial Key Laboratory of Intelligent Morphing Mechanisms and Adaptive Robotics and School of Robotics and Advanced Manufacture, Harbin Institute of Technology, Shenzhen, 518052, China. xuegaopeng@hit.edu.cn.
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22101695458%22">Microsystems & nanoengineering</searchLink> [Microsyst Nanoeng] 2026 May 13; Vol. 12 (1). <i>Date of Electronic Publication: </i>2026 May 13.
– Name: TypePub
  Label: Publication Type
  Group: TypPub
  Data: Journal Article; Review
– Name: TitleSource
  Label: Journal Info
  Group: Src
  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22Nature+Publishing+Group%22">Nature Publishing Group </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101695458 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2055-7434 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220557434%22">20557434 </searchLink><i>NLM ISO Abbreviation: </i>Microsyst Nanoeng <i>Subsets: </i>PubMed not MEDLINE
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=42129150
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1038/s41378-026-01239-8
    Languages:
      – Code: eng
        Text: English
    Titles:
      – TitleFull: A review of glass thermal reflow: method, device, and applications.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zhu M
      – PersonEntity:
          Name:
            NameFull: Shi P
      – PersonEntity:
          Name:
            NameFull: Zhang G
      – PersonEntity:
          Name:
            NameFull: Yan C
      – PersonEntity:
          Name:
            NameFull: Chen F
      – PersonEntity:
          Name:
            NameFull: Liu S
      – PersonEntity:
          Name:
            NameFull: Lian R
      – PersonEntity:
          Name:
            NameFull: Zhu K
      – PersonEntity:
          Name:
            NameFull: Dai H
      – PersonEntity:
          Name:
            NameFull: Wu H
      – PersonEntity:
          Name:
            NameFull: Liu Y
      – PersonEntity:
          Name:
            NameFull: Li B
      – PersonEntity:
          Name:
            NameFull: Du X
      – PersonEntity:
          Name:
            NameFull: Xue G
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 13
              M: 05
              Text: 2026 May 13
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-electronic
              Value: 2055-7434
          Numbering:
            – Type: volume
              Value: 12
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Microsystems & nanoengineering
              Type: main
ResultId 1